Integrated shield package and method

ABSTRACT

An integrated shield electronic component package includes a substrate having as upper surface, a lower surface, and sides extending between the upper surface and the lower surface. An electronic component is mounted to the upper surface of the substrate. An integrated shield is mounted to the upper surface of the substrate and includes a side shielding portion directly adjacent to and covering the sides of the substrate. The integrated shield covers and provides an electromagnetic interference (EMI) shield for the electronic component, the upper surface and sides of substrate. Further, the integrated shield is integrated within toe integrated shield electronic package. Thus, separate operations of mounting an electronic component package and then mounting a shield are avoided thus simplifying manufacturing and reducing overall assembly costs.

TECHNICAL FIELD

The present application relates to the field of electronics, and moreparticularly, to methods of forming electronic component packages andrelated structures.

BACKGROUND

An electronic component package generates electromagnetic radiation,which can interfere with surrounding devices in a board assembly. Thegenerated electromagnetic radiation is sometimes called electromagneticinterference (EMI). Generally, it is desirable to provide shielding toprevent the EMI from the electronic component package from interferingwith surrounding devices as well as to prevent any EMI from thesurrounding devices from interfering with the electronic componentpackage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an integrated shield electroniccomponent package in accordance with one embodiment;

FIG. 2 is a top perspective view of an integrated shield of theintegrated shield electronic component package of FIG. 1 in accordancewith one embodiment;

FIG. 3 is a cross-sectional view of an integrated shield electroniccomponent package in accordance with another embodiment; and

FIG. 4 is a cross-sectional view of an integrated shield electroniccomponent package assembly formed with the integrated shield electroniccomponent package of FIG. 3 in accordance with one embodiment.

In the following description, the same or similar elements are labeledwith the same or similar reference numbers.

DETAILED DESCRIPTION

As an overview and in accordance with one embodiment, referring to FIGS.1 and 2 together, an integrated shield electronic component package 100includes a substrate 102 having an upper surface 102U, a lower surface102L, and sides 102S extending between. upper surface 102U and lowersurface 102L. An electronic component 104 is mounted to upper surface102U of substrate 102.

An integrated shield 128 is mounted to upper surface 102U of substrate102. Integrated shield 128 covers electronic component 104 and uppersurface 102U of substrate 102. Integrated shield 128 includes a sideshielding portion 136 directly adjacent to and covering sides 102S ofsubstrate 102.

Integrated shield 128 covers and provides an electromagneticinterference (EMI) shield for electronic component 104 and upper surface102U of substrate 102. Further, by covering sides 1025 of substrate 102,side shielding portion 136 provides an EMI shield for sides 102S ofsubstrate 102.

Further, integrated shield 128 is integrated within integrated shieldelectronic package 100. Thus, separate operations of mounting anelectronic component package and then mounting a shield are avoided thussimplifying manufacturing and reducing overall assembly costs.

Now in more detail, FIG. 1 is a cross-sectional view of an integratedshield electronic component package 100 in accordance with oneembodiment. Integrated shield electronic component package 100 includesa substrate 102. Substrate 102 is a dielectric material such aslaminate, ceramic, printed circuit board material, or other dielectricmaterial.

Substrate 102 includes an upper, e.g., first, surface 102U and anopposite lower, e.g., second, surface 102L. Substrate 102 furtherincludes sides 102S, sometimes called substrate edges, extendingperpendicularly between upper surface 102U and lower surface 102L.Although the terms parallel, perpendicular, and similar terms are usedherein, it is to be understood that the described features may not beexactly parallel and perpendicular, but only substantially parallel andperpendicular to within accepted manufacturing tolerances.

Integrated shield electronic component package 100 further includes anelectronic component 104, e.g., a single die. In one embodiment,electronic component 104 is an integrated circuit chip, e.g., an activecomponent such as a high frequency ASIC device. However, in otherembodiments, electronic component 104 is a passive component such as acapacitor, resistor, or inductor. Further, in one embodiment, electroniccomponent 104 includes two or more stacked dies.

In accordance with this embodiment, electronic component 104 is a singledie and includes an active surface 106, an opposite inactive surface108, and sides 110 extending perpendicularly between active surface 106and inactive surface 108. Electronic component 104 further includes bondpads 112 formed on active surface 106.

Formed on upper surface 102U of substrate 102 are one or moreelectrically conductive upper, e.g., first, traces 114, e.g., formed ofcopper. In accordance with. this embodiment, bond pads 112 areelectrically and physically connected to upper traces 114, e.g., bondfingers thereof, by flip chip bumps 116, e.g., solder bumps, extendingbetween bond pads 112 and upper traces 114. Generally, electroniccomponent 104 is mounted to upper surface 102U of substrate 102.

Optionally, a dielectric underfill 118 is applied between upper surface102U of substrate 102 and active surface 106 of electronic component 104and encloses flip chip bumps 116.

Further, formed on upper surface 102U of substrate 102 are one or moreelectrically conductive ground terminals 120, e.g., formed of copper.Ground terminals 120 are formed on the outer periphery of upper surface102U adjacent sides 102S. Upper traces 114 are formed inward of groundterminals 120 in one embodiment.

Formed on lower surface 102L of substrate 102 are lower, e.g., second,traces 122. Lower traces 122 are electrically connected to upper traces114 and/or ground terminals 120 by electrically conductive vias 124extending through substrate 102 between upper surface 102U and lowersurface 102L.

In one embodiment, an upper trace 114 and a ground terminal(s) 120 arecoupled to the same lower trace 122. For example, where a referencevoltage source, e.g., ground, is to be provided to ground terminals 120and also to a ground bond pad of bond pads 112, the respective uppertrace 114 and ground terminal(s) 120 are connected to the same lowertrace 122, although can be connected to different lower traces 122 inother embodiments.

Although not illustrated in FIG. 1, in one embodiment, integrated shieldelectronic component package 100 further includes solder masks on upperand lower surface 102U, 102L that protect first portions of upper andlower traces 114, 122 while exposing second portions, e.g., terminalsand/or bond fingers, of upper and lower traces 114, 122 and alsoexposing ground terminals 120.

Formed on terminals 123 of lower traces 122 and generally on lowersurface 102L of substrate 102 are electrically conductiveinterconnection balls 126, e.g., solder balls in a ball grid array(BGA). In another embodiment, interconnection balls 126 are not formed,e.g., to form a land grid array (LGA). Although BGA and LGA packageconfigurations are set forth, in other embodiments, integrated shieldelectronic component package 100 is formed with other packageconfigurations.

Although a particular electrically conductive pathway between bond pads112/ground terminals 120 and interconnection balls 126 is describedabove, other electrically conductive pathways can be formed. Forexample, contact metallizations can be formed between the variouselectrical conductors.

Further, instead of straight though vias 124, in one embodiment,substrate 102 is a multilayer substrate and a plurality of vias and/orinternal traces form the electrical interconnection between upper traces114/ground terminals 120 and lower traces 122.

Although flip chip bumps 116 appear larger than interconnection balls126 in FIG. 1, in light of this disclosure, those of skill in the artwill understand. that the figure is not to scale. Typically, flip chipbumps 116 are significantly smaller than interconnection balls 126.Accordingly, in various embodiments, flip chip bumps 116 are larger,equal to, or smaller than interconnection balls 126.

Integrated shield electronic component package 100 further includes anintegrated shield. 128. Integrated shield 128 is formed of anelectrically conductive material, e.g., copper, aluminum, or otherelectrically conductive material.

FIG. 2 is a top perspective view of integrated shield 128 of integratedshield electronic component package 100 of FIG. 1 in accordance with oneembodiment. Referring now to FIGS. 1 and 2 together, integrated. shield128 includes an electronic component shielding portion 130, a substrateshielding portion 132, an electronic component to substrate transitionshielding portion 134, and a side shielding portion 136.

In one embodiment, integrated shield 128 is a single piece and not aplurality of separate pieces connected together. More particularly, inaccordance with this embodiment, electronic component shielding portion130, substrate shielding portion 132, electronic component to substratetransition shielding portion 134, and side shielding portion 136 are allportions (regions) of a single piece of conductive material, e.g.,copper, aluminum, or other electrically conductive material.

In one embodiment, integrated shield 128 is continuous, i.e., does notinclude any cuts therein. For example, integrated shield 128 is formedby stamping, bending, or other metal shaping technique.

In another embodiment, integrated shield 128 has one or more cuts,sometimes called gaps or spaces, where portions of integrated shield 128are folded together. For example, side shielding portion 136 isrectangular pieces extending from substrate shielding portion 132. Therectangular pieces of side shielding portion 136 are bent downwards fromsubstrate shielding portion 132 to contact the adjacent rectangularpieces. Accordingly, cuts 138 (see FIG. 2) exist between adjacentrectangular pieces of side shielding portion 136.

In accordance with this embodiment, electronic component shieldingportion 130 of integrated shield 128 is mounted to inactive surface 108of electronic component 104 with a thermal interface material (TIM) 140.

Generally, thermal interface material 140 has a high thermalconductivity and ensures good thermal contact between inactive surface108 of electronic component 104 and integrated shield 128. Accordingly,heat generated by electronic component 104 is conducted through thermalinterface material 140 and to integrated shield 128, which dissipatesthe heat to the ambient environment. In this manner, integrated shield128 operates as a heat sink.

In various embodiments, thermal interface material 140 includes thermalgrease, paste, adhesive such as epoxy, solder, or other thermallyconductive material. In one embodiment, thermal interface material 140is a dielectric material such that inactive surface 108 of electroniccomponent 104 is electrically isolated from integrated shield 128.

In another embodiment, thermal interface material 140 is electricallyconductive material, e.g., an electrically conductive adhesive orsolder. In accordance with this embodiment, inactive surface 108 ofelectronic component 104 is electrically coupled to integrated shield.128 by thermal interface material 140.

Electronic component shielding portion 130 of integrated shield 128 hasthe same shape as inactive surface 108 of electronic component 104.Although electronic component shielding portion 130 of integrated shield128 is said to have the same shape as inactive surface 108 of electroniccomponent 104, in light of this disclosure, those of skill in the artwill understand. that the shapes may not be exactly identical, butsubstantially identical, to within accepted manufacturing tolerances.For example, electronic component shielding portion 130 may be slightlylarger than inactive surface 108 to insure that inactive surface 108fits within the area of electronic component shielding portion 130.

In accordance with this embodiment, electronic component shieldingportion 130 is rectangular and has four edges 142. Electronic componentshielding portion 130 is parallel to inactive surface 108 and uppersurface 102U of substrate 102.

In accordance with this embodiment, substrate shielding portion 132 ofintegrated shield 128 is electrically and physically connected to groundterminals 120 by shield attach material 144. Shield attach material 144is electrically conductive, e.g., is solder or electrically conductiveadhesive. Generally, substrate shielding portion 132 of integratedshield 128 is coupled to upper surface 102U of substrate 102.

Accordingly, a reference voltage source, e.g., ground, applied to groundterminals 120 is coupled to integrated shield 128 through shield attachmaterial 144. In accordance with one embodiment, by grounding ground.terminals 120, integrated shield 128 is also grounded.

In accordance with this embodiment, substrate shielding portion 132 is arectangular annulus parallel to upper surface 102U of substrate 102.Substrate shielding portion 132 of integrated shield 128 extends to theperiphery of upper surface 102U to cover the entire upper surface 102Uof substrate 102. Substrate shielding portion 132 may be slightly largerthan upper surface 102U to insure that substrate 102 fits within thearea of substrate shielding portion 132.

Substrate shielding portion 132 has four inner edges 146 and four outeredges 148. Inner edges 146 define an inner rectangular periphery ofsubstrate shielding portion 132 and outer edges 148 define an outerrectangular periphery of substrate shielding portion 132. In light ofthis disclosure, those of skill in the art will understand that theintersection of edges 146 and edges 148 may not be exactlyperpendicular, but may be slightly rounded.

The distance D1 between upper surface 102U and of substrate shieldingportion 132 is less than the distance D2 between upper surface 102U andelectronic component shielding portion 130. Electronic component tosubstrate transition shield portion 134 connects electronic componentshielding portion 130 to substrate shielding portion 132. Moreparticularly, electronic component to substrate transition shieldportion. 134 extends between and connects edges 142 of electroniccomponent shielding portion 130 to inner edges 146 of substrateshielding portion 132.

To make up for the different heights of electronic component shieldingportion 130 and substrate shielding portion 132, electronic component tosubstrate transition shield portion 134 is sloped downwards fromelectronic component shielding portion 130 to substrate shieldingportion 132.

Electronic component shielding portion 130, substrate shielding portion132, and electronic component to substrate transition shield portion 134collectively cover and provide an electromagnetic interference (EMI)shield for electronic component 104 and upper surface 102U of substrate102. Stated another way, electronic component shielding portion 130,substrate shielding portion 132, and electronic component to substratetransition shield portion 134 collectively prevent EMI from electroniccomponent 104 and upper surface 102U of substrate 102 from interferingwith surrounding devices as well as prevent any EMI from the surroundingdevices from interfering with electronic component 104 and upper surface102U, of substrate 102.

Side shielding portion 136, sometimes called vertical extensions,extends downwards from outer edges 148 of substrate shielding portion132 around sides 102S of substrate 102. Side shielding portion 136includes four sidewalls 150A, 150B, 150C, 150D, collectively sidewalls150. It is to be understood that sidewalls 150C, 150D would not bevisible in the view of FIG. 2 and so are indicated in dashed lines forclarity of presentation.

Side shielding portion 136 including sidewalls 150 extendperpendicularly downward in a direction towards substrate 102 fromsubstrate shielding portion 132. Sidewalls 150A, 150C are parallel toone another and perpendicular to sidewalls 150B, 150D. Sidewalls 150intersect one another at corners 152 of side shielding portion 136.

Each sidewall 150 includes an upper edge 148, which also defines theouter edges 148 of substrate shielding portion 132. Stated another way,edges 148 define the transition between substrate shielding portion 132and sidewalls 150. Edges 148 may be sharp corners ta smooth curvesdepending upon the manufacturing technique used to form integratedshield 128 as those of skill in the art will understand.

Each sidewall 150 further includes a lower edge 154 parallel to therespective upper edge 148. Each sidewall 150 further includes side edges156 extending perpendicularly between the respective upper edge 148 andlower edge 154. As discussed above, integrated shield 128 can becontinuous such that sidewalls 150 are joined to the adjacent sidewalls150 at side edges 156. Alternatively, cuts 138 are formed between eachsidewall 150 such that sidewalls 150 are in abutting contact to theadjacent sidewalls 150 at side edges 156.

Lower edges 154 collectively define a lower rectangular annular edge 158of side shielding portion 136. Lower rectangular annular edge 158 ofside shielding portion 136 extends between an inner surface 160 ofintegrated shield 128 and an outer surface 162 of integrated shield 128.Accordingly, the width W of lower rectangular annular edge 158 is equalto the thickness of integrated shield 128. Lower rectangular annularedge 158 is generally a flat surface, although may be curved or deformedslightly.

Lower rectangular annular edge 158 defines the lowest portion ofintegrated shield 128. In accordance with this embodiment, lowerrectangular annular edge 158 is parallel to and coplanar with lowersurface 102L of substrate 102. Accordingly, side shielding portion 136of integrated shield 128 is directly adjacent to and covers sides 102Sof substrate 102. Side shielding portion 136 is parallel to sides 102Sand perpendicular to upper surface 102U and substrate shielding portion132.

By covering sides 1025 of substrate 102, side shielding portion 136provides an electromagnetic interference (EMI) shield for sides 102S ofsubstrate 102. Stated another way, side shielding portion 136 preventsEMI emanating from sides 102S of substrate 102 from interfering withsurrounding devices as well as prevents any EMI from the surroundingdevices from entering into sides 102S of substrate 102 and interferingwith integrated shield electronic component package 100.

Although lower rectangular annular edge 158 is illustrated and describedabove as being parallel to and coplanar with lower surface 102L ofsubstrate 102, in another embodiment, lower rectangular annular edge 158is located below upper surface 102U yet above lower surface 102L. Inaccordance with this embodiment, side shielding portion 136 ofintegrated shield 128 is directly adjacent to and covers the upperportion of sides 102S of substrate 102 while exposing the lower portionof sides 102S. When it is said that a feature such as lower rectangularannular edge 158 is above or below a surface, e.g., upper surface 102Uand/or lower surface 102L, it is to be understood that what is meant isthat a plane coplanar with the feature is above or below a planecoplanar with the surface.

In one embodiment, to fabricate integrated shield electronic componentpackage 100, electronic component 104 is flip chip mounted to substrate102 by flip chip bumps 116. Optionally, underfill 118 is applied.Integrated shield 128 is mounted to electronic component 104 and uppersurface 102U of substrate 102 by thermal interface material 140 and/orshield adhesive material 144. Integrated shield 128 is mounted such thatside shielding portion 136 extends around and covers sides 102S ofsubstrate 102. Interconnection balls 126 are formed after mounting ofintegrated shield 128, although are formed at earlier stages duringfabrication in accordance with other embodiments.

As set forth above, integrated shield 128 is mounted to substrate 102 byshield attach material 144 and/or to electronic component 104 by thermalinterface material 140. Accordingly, integrated shield electronicpackage 100 includes integrated shield 128. Stated another way,integrated shield 128 is integrated within integrated shield electronicpackage 100. Thus, separate operations of mounting an electroniccomponent package and then mounting a shield are avoided thussimplifying manufacturing and reducing overall assembly costs.

FIG. 3 is a cross-sectional view of an integrated shield electroniccomponent package 300 in accordance with another embodiment. Integratedshield electronic component package 300 of FIG. 3 is similar tointegrated shield electronic component package 100 of FIG. 1 and onlythe significant differences between integrated shield electroniccomponent packages 300, 100 are discussed below.

More particularly, integrated shield electronic component package 300 isidentical to integrated shield electronic component package 100 exceptthat side shielding portion 136 protrudes downwards past lager surface102L of substrate 102 in integrated shield electronic component package300.

Referring now to FIG. 3, side shielding portion 136 extends downwardsbelow lower surface 102L to overlap a portion of interconnection balls126. More particularly, interconnection balls 126 protrudes verticallydownwards a pre-reflow distance D3 below lower surface 102L of substrate102 in a plane perpendicular to lower surface 102L. Lower rectangularannular edge 158, i.e., a plane coplanar thereto, protrudes verticallydownwards a side shielding portion distance D4 below lower surface 102Lof substrate 102 in a plane perpendicular to lower surface 102L. Sideshielding portion distance D4 of lower rectangular annular edge 158 isless than pre-reflow distance D3 of interconnection bails 126.

By overlapping and covering a portion of interconnection balls 126, sideshielding portion 136 provides an electromagnetic interference (EMI)shield for interconnection balls 126 and lower surface 102L of substrate102. Stated another way, side shielding portion 136 prevents EMIemanating from interconnection balls 126 and lower surface 102L frominterfering with surrounding devices as well as prevents any EMI fromthe surrounding devices from entering into interconnection balls 126 andlower surface 102L and interfering with integrated shield electroniccomponent package 300.

FIG. 4 is a cross-sectional view of an integrated shield electroniccomponent package assembly 400 formed with integrated shield electroniccomponent package 300 of FIG. 3 in accordance with one embodiment.

Referring now to FIG. 4, integrated shield electronic component package300 is mounted to a larger substrate 402, sometimes called a boardassembly or motherboard, to form integrated shield electronic componentpackage assembly 400.

Larger substrate 402 includes an upper, e.g., first, surface 402U havingterminals 404 and shield terminals 406 formed thereon. Lower traces 122,e.g., terminals 123 thereof, are physically and electrically connectedto terminals 404 by interconnection balls 126. More particularly,interconnection balls 126 are placed into contact with terminals 404.Assembly 400 is heated to reflow, i.e., melt and resolidify,interconnection balls 126.

During the reflow, interconnection balls 126 collapse from the stateillustrated in FIG. 3. More particularly, after reflow, interconnectionballs 126 protrude vertically downwards a post-reflow distance D5 belowlower surface 102L of substrate 102 in a plane perpendicular to lowersurface 102L. Side shield portion distance D4 of lower rectangularannular edge 158 is less than post-reflow distance D5 of interconnectionballs 126. This prevents integrated shield 128 from interfering withreflow of interconnection balls 126.

Optionally, as illustrated in FIG. 4, side shielding portion 136including lower rectangular annular edge 158 is physically andelectrically connected to shield terminals 406 by shield adhesive 408,e.g., electrically conductive adhesive, solder, or other electricallyconductive material. Accordingly, integrated shield 128 is electricallyconnected to shield terminals 406.

Accordingly, a reference voltage source, e.g., ground, applied to shieldterminals 406 is coupled to integrated shield 128 through shieldadhesive 408. In accordance with one embodiment, by grounding shieldterminals 406, integrated shield 128 is also grounded. Stated anotherway, integrated shield 128 has a direct path to motherboard ground.

In another embodiment, larger substrate 402 is formed without shieldterminals 406. Shield adhesive 408, which can be a dielectric in thisembodiment, is applied between lower rectangular annular edge 158 andupper surface 402U of larger substrate 402. In this manner, shieldadhesive 408 provides a mechanical attachment of integrated shield 128to larger substrate 402 to provide a robust attachment of integratedshield electronic component package 300 to larger substrate 402.

In another embodiment, larger substrate 402 is formed without shieldterminals 406 and shield adhesive 408 is not applied. Accordingly, lowerrectangular annular edge 158 is in abutting contact with or slightlyspaced above upper surface 402U of larger substrate 402. In oneembodiment, the exact spacing between lower rectangular annular edge 158and upper surface 402U of larger substrate 402 is based on electricalperformance requirements, e.g., the spacing is set so that only anacceptable amount of EMI escapes from integrated shield 128.

Although integrated shield electronic component package assembly 400 isillustrated as being formed with integrated shield electronic componentpackage 300 of FIG. 3, in another embodiment, integrated shieldelectronic component package 100 of FIG. 1 is mounted to largersubstrate 402 to form an integrated shield electronic component packageassembly.

Although specific embodiments were described herein, the scope of theinvention is not limited to those specific embodiments. Numerousvariations, whether explicitly given in the specification or not, suchas differences in structure, dimension, and use of material, arepossible. The scope of the invention is at least as broad as given bythe following claims.

What is claimed is:
 1. An integrated shield electronic component packagecomprising: a substrate comprising a first surface, a second surface,and sides extending between the first surface and the second surface;terminals coupled to the second surface; interconnection structurescoupled to the terminals of the second surface; and an integrated shieldof uniform thickness coupled to the first surface of the substrate andcomprising a side shielding portion fully covering the sides of thesubstrate; wherein there is no solder material at any portion of: afirst side area between a first side of the substrate and acorresponding first side shielding portion of the integrated shield thatfaces the first side of the substrate; and a second side area between asecond side of the substrate and a corresponding second side shieldingportion of the integrated shield that faces the second side of thesubstrate.
 2. The integrated shield electronic component package ofclaim 1 wherein the side shielding portion extends a side shieldingportion distance below the second surface of the substrate and theinterconnection structures extend a post-reflow distance below thesecond surface of the substrate, the side shielding portion distancebeing less than the post-reflow distance.
 3. The integrated shieldelectronic component package of claim 1 wherein the interconnectionstructures comprise interconnection balls.
 4. The integrated shieldelectronic component package of claim 1 wherein the integrated shield isattached to a first terminal of the first surface via solder material.5. The integrated shield electronic component package of claim 1 whereinthe integrated shield is attached to a first terminal of the firstsurface via a conductive adhesive.
 6. The integrated shield electroniccomponent package of claim 1 wherein an upper surface of the integratedshield comprises a first portion, a second portion, and a roundedportion between the first portion and the second portion.
 7. A packagedelectronic component comprising: a substrate comprising a first surfacehaving a shield-attach terminal, a second surface, and sides extendingbetween the first surface and the second surface; an electroniccomponent coupled to first terminals of the first surface;interconnection structures coupled to second terminals of the secondsurface; and an integrated shield of uniform thickness coupled to thefirst surface of the substrate and comprising a side shielding portionfully covering the sides of the substrate; wherein there is no soldermaterial at any portion of: a first side area between a first side ofthe substrate and a corresponding first side shielding portion of theintegrated shield that faces the first side of the substrate; and asecond side area between a second side of the substrate and acorresponding second side shielding portion of the integrated shieldthat faces the second side of the substrate.
 8. The packaged electroniccomponent of claim 7 wherein the side shielding portion extends a sideshielding portion distance below the second surface of the substrate andthe interconnection structures extend a post-reflow distance below thesecond surface of the substrate, the side shielding portion distancebeing less than the post-reflow distance.
 9. The packaged electroniccomponent of claim 7 wherein: the integrated shield is coupled to ashield-attach structure that is conductive and that extends from theshield-attach terminal of the first surface of the substrate; theshield-attach terminal is on the first surface and bounded by the aperimeter of the first surface; and a width of a base of theshield-attach structure is bounded by a width of the shield- attachterminal.
 10. The packaged electronic component of claim 7 wherein theintegrated shield is attached to a shield-attach structure of soldermaterial that extends only over the first surface of the substrate andis coupled to the shield-attach terminal.
 11. The packaged electroniccomponent of claim 7 wherein the integrated shield is attached to ashield-attach structure of conductive adhesive that extends only overthe first surface of the substrate and is coupled to the shield-attachterminal.
 12. The packaged electronic component of claim 7, wherein theinterconnection structures comprise: a first interconnection structureelectrically coupled to the integrated shield; and a secondinterconnection structure electrically coupled to the electroniccomponent.
 13. The packed electronic component of claim 7, wherein anupper surface of the integrated shield comprises a first portion, asecond portion, and a rounded portion between the first portion and thesecond portion.
 14. A method of fabricating an integrated shieldelectronic component package, the method comprising: applying anintegrated shield of uniform thickness to a first surface of a substratecomprising the first surface, a second surface, and sides extendingbetween the first surface and the second surface such that a sideshielding portion of the integrated shield fully covers the sides of thesubstrate; and coupling interconnection structures to terminals coupledto the second surface; wherein said applying the integrated shieldapplies the integrated shield to the first surface such that there is nosolder material at any portion of: a first side area between a firstside of the substrate and a corresponding first side shielding portionof the integrated shield that faces the first side of the substrate; anda second side area between a second side of the substrate and acorresponding second side shielding portion of the integrated shieldthat faces the second side of the substrate.
 15. The method of claim 14wherein: said coupling the interconnection structures to the terminalsextends the interconnections structures a post-reflow distance below thesecond surface of the substrate; and said applying the integrated shieldto the first surface extends the side shielding portion a side shieldingportion distance below the second surface of the substrate, the sideshielding portion distance being less than the post-reflow distance. 16.The method of claim 14 wherein coupling the interconnection structuresto the terminals comprises attaching interconnection balls to theterminals.
 17. The method of claim 14 wherein coupling applying theintegrated shield to the first surface comprises attaching theintegrated shield to a first terminal of the first surface via thesolder material.
 18. The method of claim 14 wherein coupling applyingthe integrated shield to the first surface comprises attaching theintegrated shield to a first terminal of the first surface via aconductive adhesive.
 19. The method of claim 14 further comprisingforming an upper surface of the integrated shield such that theintegrated shield comprises a first portion, a second portion, and arounded portion between the first portion and the second portion.